US 12,321,023 B2
Optical transceiver modules and heat management techniques therefor
Shiping Yu, San Diego, CA (US); and Mark Harrison, Escondido, CA (US)
Assigned to Molex, LLC, Lisle, IL (US)
Filed by Molex, LLC, Lisle, IL (US)
Filed on Aug. 17, 2023, as Appl. No. 18/234,896.
Application 18/234,896 is a continuation of application No. 17/338,728, filed on Jun. 4, 2021, granted, now 11,774,693.
Claims priority of provisional application 63/037,005, filed on Jun. 10, 2020.
Prior Publication US 2023/0393356 A1, Dec. 7, 2023
Int. Cl. H04B 10/00 (2013.01); G02B 6/42 (2006.01); H05K 7/20 (2006.01)
CPC G02B 6/4269 (2013.01) [G02B 6/4284 (2013.01); H05K 7/20418 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An input/output (I/O) connector, comprising:
a body comprising a first surface, a second surface, a cable entrance port at a rear end of the body extending toward a front end of the body, and a single level pluggable portion at a front end of the body, wherein the single level pluggable portion is configured to removably seat within a cage mounted on a first printed circuit board (PCB) of a separate electronic device;
a second PCB positioned between the first surface and the second surface of the body, wherein the second PCB comprises a first set of one or more electrical components mounted on a first side of the second PCB, and wherein the second PCB performs data conversion between digital data and optical data;
a first heatsink disposed on the first surface; and
a first heatpipe positioned between the first surface and the first side of the second PCB, wherein;
the first heatpipe is thermally coupled with the first heatsink and the first set of the one or more electrical components, and
the cage is separate from the single level pluggable portion.