US 12,320,768 B2
Measuring device and measuring system
Atsuto Yoda, Nagano (JP); and Takuya Horiuchi, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on Jan. 13, 2023, as Appl. No. 18/154,366.
Claims priority of application No. 2022-015632 (JP), filed on Feb. 3, 2022.
Prior Publication US 2023/0243772 A1, Aug. 3, 2023
Int. Cl. G01N 27/22 (2006.01); G01N 33/18 (2006.01)
CPC G01N 27/226 (2013.01) [G01N 27/221 (2013.01); G01N 33/18 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A measuring device comprising:
a substrate having a first surface and a second surface on an opposite side from the first surface;
a first electrode and a second electrode provided on the substrate;
a heat-sensitive portion, provided on the first surface, and configured to detect heat of a substance that makes contact with the first surface;
a temperature sensor provided on the second surface; and
a heat transfer member, penetrating the substrate, and configured to transfer heat of the heat-sensitive portion to the temperature sensor,
wherein the heat-sensitive portion includes a first copper film.