US 12,320,718 B2
Pressure sensing circuit board and method for manufacturing the same
Fu-Yun Shen, Shenzhen (CN); Hsiao-Ting Hsu, New Taipei (TW); and Ming-Jaan Ho, New Taipei (TW)
Assigned to Avary Holding (Shenzhen) Co., Limited., Shenzhen (CN); and QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Huai an (CN)
Filed by Avary Holding (Shenzhen) Co., Limited., Shenzhen (CN); and QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Huai an (CN)
Filed on Dec. 28, 2022, as Appl. No. 18/090,397.
Application 18/090,397 is a continuation in part of application No. PCT/CN2021/101307, filed on Jun. 21, 2021.
Prior Publication US 2023/0160764 A1, May 25, 2023
Int. Cl. G01L 1/22 (2006.01)
CPC G01L 1/2262 (2013.01) 13 Claims
OG exemplary drawing
 
1. A pressing sensing circuit board, comprising:
a dielectric layer;
a wiring layer stacked on the dielectric layer;
a strain layer stacked on the wiring layer; and
a protective layer stacked on the wiring layer and the strain layer;
wherein the pressing sensing circuit board comprises a first copper area, a second copper area, and a copper-free area connected in that order, the wiring layer is located in the first copper area and the second copper area; along a stacking direction of the wiring layer and the dielectric layer, a thickness of the wiring layer in the first copper area is greater than a thickness of the wiring layer in the second copper area, the wiring layer in the second copper area comprises a mesh-shaped wiring portion; the strain layer is located in the copper-free area and connected to the wiring layer; the protective layer is formed on the wiring layer in the second copper area and further covers the strain layer.