US 12,320,005 B2
Hot-dip plated steel material
Kohei Tokuda, Tokyo (JP); Mamoru Saito, Tokyo (JP); Yasuto Goto, Tokyo (JP); and Fumiaki Nakamura, Tokyo (JP)
Assigned to NIPPON STEEL CORPORATION, Tokyo (JP)
Appl. No. 18/838,856
Filed by NIPPON STEEL CORPORATION, Tokyo (JP)
PCT Filed Feb. 21, 2023, PCT No. PCT/JP2023/006113
§ 371(c)(1), (2) Date Aug. 15, 2024,
PCT Pub. No. WO2023/157974, PCT Pub. Date Aug. 24, 2023.
Claims priority of application No. 2022-024940 (JP), filed on Feb. 21, 2022.
Prior Publication US 2025/0109474 A1, Apr. 3, 2025
Int. Cl. C23C 2/06 (2006.01); B32B 15/01 (2006.01); C22C 18/04 (2006.01); C23C 2/28 (2006.01); C23C 2/40 (2006.01)
CPC C23C 2/06 (2013.01) [B32B 15/012 (2013.01); B32B 15/013 (2013.01); C22C 18/04 (2013.01); C23C 2/28 (2013.01); C23C 2/40 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A hot-dip plated steel material that is a plated steel material comprising a plating layer on a surface of a steel material, wherein
the plating layer has an average chemical composition including, in mass %,
Al: more than 22.5% and 50.0% or less,
Mg: more than 3.0% and 15.0% or less,
Sn: 0% or more and 0.7% or less,
Bi: 0% or more and 0.3% or less,
In: 0% or more and 0.3% or less,
Ca: 0.03% or more and 0.6% or less,
Y: 0% or more and 0.30% or less,
La: 0% or more and 0.30% or less,
Ce: 0% or more and 0.30% or less,
Si: 0.03% or more and 1.0% or less,
Cr: 0% or more and 0.25% or less,
Ti: 0% or more and 0.25% or less,
Ni: 0% or more and 0.25% or less,
Co: 0% or more and 0.25% or less,
V: 0% or more and 0.25% or less,
Nb: 0% or more and 0.25% or less,
Cu: 0% or more and 0.25% or less,
Mn: 0% or more and 0.25% or less,
Fe: 2.0% or more and 25% or less,
Sr: 0% or more and 0.50% or less,
Sb: 0% or more and 0.50% or less,
Pb: 0% or more and 0.50% or less,
B: 0% or more and 0.50% or less,
Li: 0% or more and 0.50% or less,
Zr: 0% or more and 0.50% or less,
Mo: 0% or more and 0.50% or less,
W: 0% or more and 0.50% or less,
Ag: 0% or more and 0.50% or less,
P: 0% or more and 0.50% or less, and
a remainder consisting of Zn and impurities,
a total amount ΣA of Sn, Bi, and In is 0% or more and 0.7% or less,
a total amount ΣB of Ca, Y, La, and Ce is 0.03% or more and 0.60% or less,
a total amount ΣC of Cr, Ti, Ni, Co, V, Nb, Cu, and Mn is 0% or more and 0.25% or less,
a total amount ΣD of Sr, Sb, Pb, B, Li, Zr, Mo, W, Ag, and P is 0% or more and 0.50% or less,
following formulas (1) to (3) are satisfied,
in an X-ray diffraction pattern of a surface of the plating layer, measured under conditions in which an X-ray output is a voltage of 50 kV and a current of 300 mA using a Cu-Kα ray, when I1 obtained from an X-ray diffraction peak of Al0.5Fe1.5 is defined by formula (A-1), formula (A-2) is satisfied, and
when I2 obtained from X-ray diffraction peaks of Zn, Al, and MgZn2 is defined by formula (B-1), formula (B-2) is satisfied,
Sn≤Si  (1)
15≤Mg/Si  (2)
1.0≤Si/Ca≤5.0  (3)

OG Complex Work Unit Math
provided that, in formulas (1) to (3), Sn, Si, Mg, and Ca represent contents (mass %) of respective elements in the plating layer, Imax (k to m°) in formulas (A-1) and (B-1) represents an absolute maximum value of an X-ray diffraction intensity between a diffraction angle of k° and a diffraction angle of m°, Imax (n°) in formula (A-1) represents an X-ray diffraction intensity at a diffraction angle of n°, and k, m, and n each represent a diffraction angle indicated in formulas (A-1) and (B-1).