	US 12,319,849 B2
	Adhesive composition, room-temperature-curable adhesive, and cured object
Hidenori Tanaka, Osaka (JP)
Assigned to Kaneka Corporation, Osaka (JP)
Appl. No. 18/274,365
Filed by KANEKA CORPORATION, Osaka (JP)
PCT Filed Jan. 21, 2022, PCT No. PCT/JP2022/002172 § 371(c)(1), (2) Date Jul. 26, 2023, PCT Pub. No. WO2022/163523, PCT Pub. Date Aug. 4, 2022.
Claims priority of application No. 2021-012360 (JP), filed on Jan. 28, 2021.
Prior Publication US 2024/0101878 A1, Mar. 28, 2024
Int. Cl. C09J 171/02 (2006.01); C09J 11/06 (2006.01)

CPC C09J 171/02 (2013.01) [C09J 11/06 (2013.01); C09J 2301/408 (2020.08); C09J 2471/00 (2013.01)]

9 Claims

1. An adhesive composition comprising:

a polyoxypropylene-based polymer (A) which has, at a terminal thereof, not less than 0.6 (meth)acryloyl groups on average and which has a number average molecular weight of not less than 5,000;

a methacrylate compound (B) having a glass transition temperature of higher than 60° C. in a state of a homopolymer;

an organic peroxide (C); and

a reducing agent (D).