US 12,319,563 B2
Semiconductor package with metal column mold barrier
Rafael Jose Lizares Guevara, Makati (PH); and James Raymond Maliclic Baello, Mabalacat (PH)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Jun. 11, 2021, as Appl. No. 17/345,707.
Prior Publication US 2022/0396474 A1, Dec. 15, 2022
Int. Cl. B81C 1/00 (2006.01); B81B 7/00 (2006.01); G01N 27/22 (2006.01)
CPC B81B 7/0061 (2013.01) [B81C 1/00309 (2013.01); G01N 27/223 (2013.01); B81B 2201/0214 (2013.01); B81B 2207/07 (2013.01); B81B 2207/098 (2013.01); B81C 2203/0154 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method of forming a semiconductor package comprising:
plating solder on a surface of a semiconductor die to form a perimeter around a sensor of the semiconductor die;
placing a set of metal columns on the solder;
reflowing the solder coating to solder the set of metal columns to the semiconductor die;
electrically coupling terminals of the semiconductor die to a plurality of leads; and
molding a mold compound over the semiconductor die except for an area inside the perimeter on the surface of the semiconductor die such that the sensor is exposed to ambient air.