US 12,319,062 B2
Printhead module having alternate PCBs and rows of print chips
Jason Mark Thelander, North Ryde (AU); and David Oliver Burke, North Ryde (AU)
Assigned to Memjet Technology Limited, Dublin (IE)
Filed by Memjet® Technology Limited, Leopardstown (IE)
Filed on Jun. 22, 2023, as Appl. No. 18/339,907.
Application 18/339,907 is a continuation of application No. 17/744,028, filed on May 13, 2022, granted, now 11,718,096.
Application 17/744,028 is a continuation of application No. 17/017,333, filed on Sep. 10, 2020, granted, now 11,358,391, issued on Jun. 14, 2022.
Claims priority of provisional application 63/023,370, filed on May 12, 2020.
Claims priority of provisional application 62/900,356, filed on Sep. 13, 2019.
Prior Publication US 2023/0330991 A1, Oct. 19, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B41J 2/145 (2006.01); B41J 2/14 (2006.01); B41J 2/155 (2006.01); B41J 2/17 (2006.01); B41J 2/175 (2006.01); B41J 2/21 (2006.01)
CPC B41J 2/145 (2013.01) [B41J 2/14 (2013.01); B41J 2/14209 (2013.01); B41J 2/1433 (2013.01); B41J 2/155 (2013.01); B41J 2/17 (2013.01); B41J 2/175 (2013.01); B41J 2/2103 (2013.01); B41J 2002/14491 (2013.01); B41J 2202/13 (2013.01); B41J 2202/20 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A printhead module, comprising:
a monolithic substrate having a plurality of longitudinal ink supply channels defined through a thickness of the substrate and extending parallel with each other along a length of the substrate;
a plurality of rows of print chips mounted on a front face of the substrate, each row of print chips receiving ink only from a respective one of the ink supply channels; and
a plurality of first PCBs mounted on the front face, each PCB extending alongside a respective one of the rows of print chips and supply power thereto, wherein the plurality of rows of print chips and the plurality of first PCBs are mounted alternately across the front face of the substrate.