US 12,319,042 B2
Multi-layer release stack for light induced transfer of components
Rob Jacob Hendriks, Waalre (NL)
Assigned to Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO, 's-Gravenhage (NL)
Appl. No. 18/279,841
Filed by Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO, 's-Gravenhage (NL)
PCT Filed Mar. 1, 2022, PCT No. PCT/NL2022/050114
§ 371(c)(1), (2) Date Aug. 31, 2023,
PCT Pub. No. WO2022/186689, PCT Pub. Date Sep. 9, 2022.
Claims priority of application No. 21160226 (EP), filed on Mar. 2, 2021.
Prior Publication US 2024/0140081 A1, May 2, 2024
Int. Cl. B32B 37/00 (2006.01); B32B 7/12 (2006.01); B32B 15/04 (2006.01); H01L 21/67 (2006.01)
CPC B32B 37/025 (2013.01) [B32B 7/12 (2013.01); B32B 15/04 (2013.01); H01L 21/67132 (2013.01); B32B 2307/412 (2013.01); B32B 2307/748 (2013.01); B32B 2310/0837 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A method for light induced transfer of components from a donor substrate to an acceptor substrate, wherein the donor substrate comprises;
a transparent carrier configured to carry the components facing the acceptor substrate, and
a release stack disposed between the transparent carrier and the components for releasing one or more of the components from the donor substrate onto the acceptor substrate following illumination of the release stack by a light beam through the transparent carrier, wherein the release stack comprises:
a melt layer formed by a metal or alloy layer having a first melting temperature,
a light-absorbing layer disposed between the transparent carrier and the melt layer, wherein the light-absorbing layer has an absorption coefficient for absorbing the light beam thereby causing the light-absorbing layer to be heated, wherein the heated light-absorbing layer is in thermal contact with the melt layer for conducting its heat to the melt layer thereby causing a temperature of the melt layer to rise above the first melting temperature, wherein the light-absorbing layer has a second melting temperature which is higher than the first melting temperature of the melt layer such that the light-absorbing layer can remain solid while the melt layer is melted by the heat conducted from the light-absorbing layer, and
an adhesive layer formed by an organic or non-metal layer adhering the components to the melt layer while the melt layer is solid and releasing adhesion when the melt layer is melted; and
wherein the method comprises illuminating an area of the light-absorbing layer, forming a part of the release stack holding a respective component, with a light beam through the transparent carrier to heat a respective part of the light-absorbing layer, wherein the heat is conducted to an adjacent melt layer of the release stack thereby melting the adjacent melt layer while the respective part of the light-absorbing layer remains solid, wherein the melting of the adjacent melt layer causes a loss of adhesion between the adjacent melt layer and a respective part of the adhesive layer of the release stack adhering the respective components to the adjacent melt layer, and wherein the loss of adhesion causes release and transfer of the respective component.