| CPC B29C 35/12 (2013.01) [B29C 33/04 (2013.01); B29C 33/08 (2013.01); F24H 1/203 (2013.01)] | 6 Claims |
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1. A mold temperature control system for heating or cooling a mold comprising a flow channel therein, the mold temperature control system comprising:
a dielectric heating module including:
a heating circuit for connecting with the flow channel, the heating circuit providing passage of a high-temperature heat medium;
a dielectric heater made of conductors and containing the high-temperature heat medium;
a high-frequency power supply providing a high-frequency AC signal to the dielectric heater, such that heat is generated on surfaces of the dielectric heater to heat the high-temperature heat medium contained in the dielectric heater;
a high-temperature heat medium storage tank connected to the heating circuit and storing the heated high-temperature heat medium; and
a heat circulation pump connected to the heating circuit and driving the high-temperature heat medium to flow through the dielectric heater and the high-temperature heat medium storage tank in the heating circuit;
a cooling module including:
a cooling circuit for connecting with the flow channel, the cooling circuit providing passage of a low-temperature heat medium; and
a heat exchanger connected to the cooling circuit and cooling the low-temperature heat medium;
a low-temperature heat medium storage tank connected to the cooling circuit and storing the low-temperature heat medium;
a cold circulation pump connected to the cooling circuit and driving the low-temperature heat medium to flow through the heat exchanger and the low-temperature heat medium storage tank in the cooling circuit; and
a flow control module including a plurality of thermal switch valves connected to the heating circuit and the flow channel, and configured to be switched between a mold heating mode where the high-temperature heat medium circulates in the heating circuit and the flow channel to heat the mold and a high-temperature heat medium self-circulation mode where the high-temperature heat medium circulates in the heating circuit without flowing through the flow channel, and a plurality of cooling switch valves connected to the cooling circuit and the flow channel, and configured to be switched between a mold cooling mode where the low-temperature heat medium circulates in the cooling circuit and the flow channel to cool the mold and a low-temperature heat medium self-circulation mode where the low-temperature heat medium circulates in the cooling circuit without flowing through the flow channel.
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