US 12,318,864 B2
Method for microwelding flexible thin films, for example for use in electrical and electronic devices
Andreas Heider, Stuttgart (DE); Axel Bormann, Bamberg (DE); Gerhard Kunz, Renningen (DE); Johannes Proell, Bamberg (DE); and Lukas Alter, Stuttgart (DE)
Assigned to Robert Bosch GmbH, Stuttgart (DE)
Filed by Robert Bosch GmbH, Stuttgart (DE)
Filed on Sep. 29, 2020, as Appl. No. 17/036,031.
Claims priority of application No. 102019215000.4 (DE), filed on Sep. 30, 2019.
Prior Publication US 2021/0094125 A1, Apr. 1, 2021
Int. Cl. B23K 26/00 (2014.01); B23K 26/0622 (2014.01); B23K 26/082 (2014.01); B23K 26/12 (2014.01); B23K 26/24 (2014.01); B23K 26/60 (2014.01); G06K 19/077 (2006.01); B23K 101/42 (2006.01); B23K 103/12 (2006.01)
CPC B23K 26/24 (2013.01) [B23K 26/0622 (2015.10); B23K 26/082 (2015.10); B23K 26/123 (2013.01); B23K 26/60 (2015.10); B23K 2101/42 (2018.08); B23K 2103/12 (2018.08)] 21 Claims
OG exemplary drawing
 
1. A method for welding a flexible film (10) to a carrier component (20), having the following steps:
1) Pressing the film (10) on the carrier component (20) by a volumetric flow of a fluid, and
2) laser welding the film (10) on the carrier component (20),
wherein before step 1), a pre-deforming of the film (10) is performed using a method that does not include the volumetric flow of fluid and is done by means of a negative mold (M), and
wherein the method is used for welding a flexible film (10) in the form of a flexible trace embedded within a flexible circuit board (FPC) to an electrical carrier component (20) in the form of landing on a rigid circuit board (PCB).