US 12,318,618 B2
Implantable medical device with feedthrough antenna ground structure
Daniel Joseph Landherr, Wyoming, MN (US); Ron A. Balczewski, Bloomington, MN (US); Keith R. Maile, New Brighton, MN (US); Benjamin J. Haasl, Forest Lake, MN (US); Jason Lahr, Coon Rapids, MN (US); Niharika Varanasi, Shoreview, MN (US); Thao N. Nguyen, Lakeville, MN (US); and Katherine Hauwiller, Plymouth, MN (US)
Assigned to CARDIAC PACEMAKERS, INC.
Filed by CARDIAC PACEMAKERS, INC., St. Paul, MN (US)
Filed on Mar. 15, 2022, as Appl. No. 17/695,599.
Claims priority of provisional application 63/161,254, filed on Mar. 15, 2021.
Prior Publication US 2022/0288401 A1, Sep. 15, 2022
Int. Cl. A61N 1/375 (2006.01); A61N 1/372 (2006.01); H01Q 1/27 (2006.01); H04Q 9/00 (2006.01)
CPC A61N 1/37223 (2013.01) [A61N 1/3754 (2013.01); H01Q 1/273 (2013.01); H04Q 9/00 (2013.01); H04Q 2209/43 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An implantable medical device (IMD) comprising:
a conductive housing configured to provide an enclosure;
circuitry disposed within the enclosure including at least a power source and a printed circuit board assembly (PCBA), the PCBA carrying at least an RF generator configured for use as a telemetry circuit for the IMD by operation within a communication frequency range, the PCBA including a first dielectric layer and a first metallization layer therein, the first metallization layer comprising an RF portion serving as an RF ground plane for the RF generator, the RF generator having a direct electrical connection to the RF portion;
a header coupled to the conductive housing;
at least one feedthrough wire extending from the header into the enclosure of the conductive housing; and
a ferrule surrounding the feedthrough, the ferrule coupled to the conductive housing, wherein the ferrule is attached to the PCBA such that the ferrule is separated by the first dielectric layer from the RF ground plane, thereby creating capacitive coupling between the ferrule and the RF ground plane, and the ferrule is sized and shaped to provide an impedance via the capacitive coupling of less than 3 ohms between the RF ground plane and the conductive housing within the communication frequency range.