US RE49,987 E1
Multiple plated via arrays of different wire heights on a same substrate
Cyprian Emeka Uzoh, San Jose, CA (US); and Rajesh Katkar, Milpitas, CA (US)
Assigned to Invensas LLC, San Jose, CA (US)
Filed by Invensas LLC, San Jose, CA (US)
Filed on Apr. 20, 2022, as Appl. No. 17/725,442.
Application 17/725,442 is a continuation of application No. 16/008,531, filed on Jun. 14, 2018, granted, now 10,290,613, issued on May 14, 2019.
Application 16/008,531 is a continuation of application No. 15/430,943, filed on Feb. 13, 2017, granted, now 10,026,717, issued on Jul. 17, 2018.
Application 15/430,943 is a continuation of application No. 14/841,381, filed on Aug. 31, 2015, granted, now 9,583,456, issued on Feb. 28, 2017.
Application 14/841,381 is a continuation in part of application No. 14/087,252, filed on Nov. 22, 2013, granted, now 9,263,394, issued on Feb. 16, 2016.
Application 17/725,442 is a reissue of application No. 16/245,116, filed on Jan. 10, 2019, granted, now 10,629,567, issued on Apr. 21, 2020.
Int. Cl. H01L 25/065 (2023.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/42 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 25/16 (2023.01); H01L 49/02 (2006.01)
CPC H01L 25/0657 (2013.01) [B81B 7/0074 (2013.01); B81C 1/0023 (2013.01); H01L 21/4853 (2013.01); H01L 23/3675 (2013.01); H01L 23/42 (2013.01); H01L 23/481 (2013.01); H01L 23/49811 (2013.01); H01L 23/522 (2013.01); H01L 23/5383 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/24 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 24/94 (2013.01); H01L 24/97 (2013.01); H01L 25/0652 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01L 28/10 (2013.01); H01L 28/20 (2013.01); H01L 28/40 (2013.01); H01L 24/02 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/81 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/0332 (2013.01); H01L 2224/0333 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03452 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/0347 (2013.01); H01L 2224/03614 (2013.01); H01L 2224/0391 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/03914 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05111 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05169 (2013.01); H01L 2224/05184 (2013.01); H01L 2224/05547 (2013.01); H01L 2224/05565 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05616 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05669 (2013.01); H01L 2224/05684 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11464 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11903 (2013.01); H01L 2224/1191 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13169 (2013.01); H01L 2224/13184 (2013.01); H01L 2224/13565 (2013.01); H01L 2224/13616 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14131 (2013.01); H01L 2224/14132 (2013.01); H01L 2224/14134 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/24147 (2013.01); H01L 2224/24227 (2013.01); H01L 2224/244 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/3303 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48149 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/73201 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81825 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06568 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/1206 (2013.01); H01L 2924/1207 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19103 (2013.01); H01L 2924/20751 (2013.01); H01L 2924/20752 (2013.01); H01L 2924/20753 (2013.01); H01L 2924/20754 (2013.01); H01L 2924/20755 (2013.01); H01L 2924/20756 (2013.01); H01L 2924/20757 (2013.01); H01L 2924/20758 (2013.01); H01L 2924/20759 (2013.01); H01L 2924/2076 (2013.01); H01L 2924/3841 (2013.01)] 43 Claims
OG exemplary drawing
 
[ 21. An apparatus, comprising:
a first substrate;
first plated conductors on a first region of a surface of the first substrate, the first plated conductors directly coupled to the surface of the first substrate;
second plated conductors on a second region of the surface of the first substrate, the second plated conductors directly coupled to the surface of the first substrate;
wherein:
the first plated conductors and the second plated conductors are external to the first substrate;
the first region is disposed at least partially within the second region;
the first plated conductors are of a first height; and
the second plated conductors are of a second height greater than the first height;
a first electronic component coupled to ends of the first plated conductors;
a second substrate coupled to ends of the second plated conductors, the second substrate comprising a laminate substrate; and
a second electronic component coupled to the second substrate and located over the first electronic component.]