US D1,029,066 S
Mainframe of dual-robot substrate processing system
Michael R. Rice, Pleasanton, CA (US); Michael C. Kuchar, Georgetown, TX (US); Travis Morey, Austin, TX (US); Adam J. Wyatt, Round Rock, TX (US); and Ofer Amir, Half Moon Bay, CA (US)
Assigned to APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed by APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed on Mar. 11, 2022, as Appl. No. 29/830,396.
Term of patent 15 Years
LOC (14) Cl. 15 - 09
U.S. Cl. D15—141  [D15/138]
OG exemplary drawing
 
The ornamental design for a mainframe for a dual-robot substrate processing system, as shown and described.