US D1,028,945 S
Earphone
Deng Xu Cao, Hong Kong (HK)
Assigned to JVCKENWOOD Corporation, Yokohama (JP)
Filed by JVCKENWOOD Corporation, Yokohama (JP)
Filed on Dec. 19, 2022, as Appl. No. 29/863,364.
Claims priority of application No. 2022-013611 D (JP), filed on Jun. 24, 2022.
Term of patent 15 Years
LOC (14) Cl. 14 - 01
U.S. Cl. D14—223
OG exemplary drawing
 
The ornamental design for an earphone, as shown and described.