US 11,997,914 B2
Method of manufacturing organic light-emitting display device
Hyun Min Cho, Hwaseong-si (KR); Shin Il Choi, Hwaseong-si (KR); Sang Gab Kim, Seoul (KR); and Tae Sung Kim, Incheon (KR)
Assigned to Samsung Display Co., Ltd., Yongin-si (KR)
Appl. No. 17/255,406
Filed by Samsung Display Co., LTD., Yongin-si (KR)
PCT Filed Dec. 21, 2018, PCT No. PCT/KR2018/016441
§ 371(c)(1), (2) Date Dec. 22, 2020,
PCT Pub. No. WO2020/004747, PCT Pub. Date Jan. 2, 2020.
Claims priority of application No. 10-2018-0072844 (KR), filed on Jun. 25, 2018.
Prior Publication US 2021/0376243 A1, Dec. 2, 2021
Int. Cl. H01L 29/786 (2006.01); H10K 59/121 (2023.01); H10K 59/124 (2023.01); H10K 71/16 (2023.01); H10K 71/20 (2023.01); H10K 71/00 (2023.01); H10K 102/00 (2023.01)
CPC H10K 71/233 (2023.02) [H10K 59/1216 (2023.02); H10K 59/124 (2023.02); H10K 71/166 (2023.02); H10K 71/00 (2023.02); H10K 2102/00 (2023.02); H10K 2102/351 (2023.02)] 21 Claims
OG exemplary drawing
 
1. A method of manufacturing an organic light-emitting display device, the method comprising:
forming a lower electrode pattern on a substrate, which includes a transistor area and a capacitor area, to correspond to the transistor area;
forming a buffer layer on the substrate including the lower electrode pattern;
forming a thin-film transistor including an oxide semiconductor layer on the buffer layer;
forming an interlayer insulating film on the thin-film transistor;
forming a photoresist film pattern including first and second holes, which have different depths, on the interlayer insulating film; and
forming a first contact hole, which exposes the lower electrode pattern, and second contact holes, which expose the oxide semiconductor layer, at the same time using the photoresist film pattern,
wherein the photoresist film pattern includes a residual photoresist disposed between the second holes and the interlayer insulating film,
wherein the interlayer insulating film includes:
a second interlayer insulating film on the buffer layer; and
a first interlayer insulating film between the second interlayer insulating film and the buffer layer, wherein
the first interlayer insulating film is thicker than the second interlayer insulating film.