US 11,997,827 B2
Immersion cooling system that enables increased heat flux at heat-generating components of computing devices
Husam Atallah Alissa, Redmond, WA (US); Bharath Ramakrishnan, Bellevue, WA (US); Ioannis Manousakis, Heraklion (GR); Nicholas Andrew Keehn, Kirkland, WA (US); and Eric Clarence Peterson, Woodinville, WA (US)
Assigned to Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed by Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed on Jun. 22, 2023, as Appl. No. 18/212,961.
Application 18/212,961 is a division of application No. 17/320,063, filed on May 13, 2021, granted, now 11,729,948.
Prior Publication US 2023/0337396 A1, Oct. 19, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/203 (2013.01) [H05K 7/20381 (2013.01); H05K 7/20818 (2013.01); H05K 7/20836 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for subcooling a dielectric working fluid in an immersion cooling system that comprises a plurality of computing devices, the method comprising:
determining a desired temperature of the dielectric working fluid, wherein the desired temperature of the dielectric working fluid is less than a boiling point of the dielectric working fluid;
calculating an error value as a difference between the desired temperature of the dielectric working fluid and a measured temperature of the dielectric working fluid;
causing coolant to flow to a subcooling heat exchanger based at least in part on the error value when the measured temperature of the dielectric working fluid is greater than the desired temperature of the dielectric working fluid; and
preventing the coolant from flowing to the subcooling heat exchanger when the measured temperature of the dielectric working fluid is less than or equal to the desired temperature of the dielectric working fluid.