US 11,997,819 B2
Data processing systems including optical communication modules
Peter Johannes Winzer, Aberdeen, NJ (US); Brett Michael Dunn Sawyer, Pasadena, CA (US); Peter James Pupalaikis, Ramsey, NJ (US); Clinton Randy Giles, Watchung, NJ (US); and Guilhem de Valicourt, Jersey City, NJ (US)
Assigned to Nubis Communications, Inc., New Providence, NJ (US)
Filed by Nubis Communications, Inc., Aberdeen, NJ (US)
Filed on Nov. 3, 2023, as Appl. No. 18/501,542.
Application 18/501,542 is a continuation of application No. 18/113,975, filed on Feb. 24, 2023, granted, now 11,895,798.
Application 18/113,975 is a continuation of application No. 17/478,483, filed on Sep. 17, 2021.
Application 17/478,483 is a continuation in part of application No. PCT/US2021/035179, filed on Jun. 1, 2021.
Application PCT/US2021/035179 is a continuation in part of application No. PCT/US2021/022730, filed on Mar. 17, 2021.
Claims priority of provisional application 63/245,005, filed on Sep. 16, 2021.
Claims priority of provisional application 63/245,011, filed on Sep. 16, 2021.
Claims priority of provisional application 63/225,779, filed on Jul. 26, 2021.
Claims priority of provisional application 63/223,685, filed on Jul. 20, 2021.
Claims priority of provisional application 63/210,437, filed on Jun. 14, 2021.
Claims priority of provisional application 63/208,759, filed on Jun. 9, 2021.
Claims priority of provisional application 63/192,852, filed on May 25, 2021.
Claims priority of provisional application 63/178,501, filed on Apr. 22, 2021.
Claims priority of provisional application 63/175,021, filed on Apr. 14, 2021.
Claims priority of provisional application 63/173,253, filed on Apr. 9, 2021.
Claims priority of provisional application 63/159,768, filed on Mar. 11, 2021.
Claims priority of provisional application 63/146,421, filed on Feb. 5, 2021.
Claims priority of provisional application 63/145,368, filed on Feb. 3, 2021.
Claims priority of provisional application 63/116,660, filed on Nov. 20, 2020.
Claims priority of provisional application 63/088,914, filed on Oct. 7, 2020.
Claims priority of provisional application 63/080,528, filed on Sep. 18, 2020.
Prior Publication US 2024/0064922 A1, Feb. 22, 2024
Int. Cl. H05K 7/14 (2006.01); G02B 6/42 (2006.01); G02B 6/43 (2006.01); H04B 10/27 (2013.01); H05K 1/14 (2006.01)
CPC H05K 7/1487 (2013.01) [G02B 6/4206 (2013.01); G02B 6/43 (2013.01); H04B 10/27 (2013.01); H05K 1/141 (2013.01)] 29 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a grid structure having walls that define multiple openings, wherein each opening is configured to receive a corresponding optical communication module, and each optical communication module comprises a photonic integrated circuit and an electrical interface electrically coupled to the photonic integrated circuit;
wherein for each opening, the walls also define one or more retaining mechanisms such that when the corresponding optical communication module is inserted into the opening, the one or more retaining mechanisms on the walls of the grid structure engage one or more latch mechanisms on the optical communication module to secure the optical communication module to the grid structure;
wherein the grid structure is configured to be attached to a substrate or a circuit board having a main surface that is substantially perpendicular to the walls that define the multiple openings, wherein for each opening, the substrate or the circuit board has a corresponding electrical interface;
wherein the grid structure is configured to guide the optical communication modules and align the electrical interface of each optical communication module to the corresponding electrical interface on the substrate or the circuit board;
wherein the walls are configured such that each opening has a depth, a width, and a height;
wherein the depth is greater than the width and the height; and
wherein the depth is measured along a first direction substantially parallel to the walls that define the opening, the width is measured along a second direction substantially perpendicular to the walls that define the opening, the height is measured along a third direction substantially perpendicular to the walls that define the opening, and the third direction is substantially perpendicular to the second direction.
 
6. An apparatus comprising:
a grid structure having walls that define multiple openings, wherein each opening has a shape that is configured to receive a corresponding optical communication module, each optical communication module comprises a photonic integrated circuit and an electrical interface electrically coupled to the photonic integrated circuit;
wherein the grid structure is configured to be attached to a substrate or a circuit board having a main surface that is substantially perpendicular to the walls that define the multiple openings, wherein for each opening, the substrate or the circuit board has a corresponding electrical interface positioned along a plane substantially parallel to the main surface of the substrate or the circuit board;
wherein the walls of the grid structure are configured to guide each optical communication module to move along a direction substantially perpendicular to the main surface of the substrate or the circuit board as the optical communication module is inserted through the corresponding opening and move toward the substrate or the circuit board;
wherein the walls of the grid structure is configured to guide each optical communication module to be oriented such that as the optical communication module is inserted through the corresponding opening and move towards the substrate or the circuit board, the electrical interface of the optical communication module are positioned along a plane substantially parallel to the main surface of the substrate or the circuit board;
wherein the walls of the grid structure is configured to align the electrical interface of each optical communication module to the corresponding electrical interface on the substrate or the circuit board;
wherein the walls are configured such that each opening has a depth, a width, and a height;
wherein the depth is greater than the width and the height; and
wherein the depth is measured along a first direction substantially parallel to the walls that define the opening, the width is measured along a second direction substantially perpendicular to the walls that define the opening, the height is measured along a third direction substantially perpendicular to the walls that define the opening, and the third direction is substantially perpendicular to the second direction.
 
14. An apparatus comprising:
a grid structure that defines at least one opening, wherein the grid structure is configured to be attached to a substrate or a circuit board, and for each opening, the substrate or the circuit board has a corresponding electrical interface;
for each opening, a guide mechanism configured to be positioned at a front side of the substrate or the circuit board, wherein the guide mechanism is configured to guide an optical communication module to pass through the opening and electrically coupled to the substrate or the circuit board, and the optical communication module comprises a photonic integrated circuit and an electrical interface electrically coupled to the photonic integrated circuit;
a bolster plate configured to be positioned at a back side of the substrate or the circuit board and connected to the guide mechanism by a mechanical connector, wherein the mechanical connector is configured to pass through the substrate or the circuit board to connect the guide mechanism to the bolster plate; and
wherein for each opening, the guide mechanism is configured to guide a corresponding optical communication module and align the electrical interface of the optical communication module with the corresponding electrical interface of the substrate or the circuit board; and
a plurality of clamp mechanisms, wherein each clamp mechanism is configured to selectively exert a first force to push or pull the optical communication module towards the front side of the substrate or the circuit board, and exert a second force to push or pull the bolster plate against the back side of the substrate or the circuit board, wherein the first force and the second force cause the electrical interface of the optical communication module to be pressed against the corresponding electrical interface on the substrate or the circuit board.
 
17. An apparatus comprising:
a first structure configured to be disposed on a first side of a substrate or a circuit board having a plurality of electrical interfaces and to guide a plurality of optical interconnect modules having electrical interfaces to be electrically coupled to the substrate or circuit board;
a second structure configured to be disposed on a second side of the substrate or circuit board, the second side being opposite the first side;
a mechanical connector configured to pass through the substrate or circuit board and connect the first structure to the second structure;
wherein the first structure comprises an array of at least two rows and at least two columns of guide structures that define an array of at least two rows and at least two columns of openings, each guide structure is configured to guide a corresponding optical interconnect module and align the electrical interface of the optical interconnect module to the corresponding electrical interface on the substrate or circuit board; and
a plurality of clamp mechanisms each configured to selectively exert forces to cause the electrical interface of a corresponding optical interconnect module to be pressed against the corresponding electrical interface on the substrate or circuit board such that the electrical interface of the optical interconnect module is securely mechanically and electrically coupled to the electrical interface on the substrate or circuit board.