US 11,997,812 B2
Cover for sealing a power module
Kevin Richard Fine, Redwood City, CA (US); Peter H. J How, Mililani, HI (US); Charles Ingalz, San Jose, CA (US); Steven Nicholas Grolle, Los Altos, CA (US); and Stephen Robert Bannick, San Francisco, CA (US)
Assigned to Lunar Energy, Inc., Mountain View, CA (US)
Filed by Lunar Energy, Inc., Mountain View, CA (US)
Filed on Oct. 12, 2022, as Appl. No. 17/964,667.
Prior Publication US 2024/0130064 A1, Apr. 18, 2024
Int. Cl. H05K 5/00 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 5/06 (2006.01); H05K 7/20 (2006.01)
CPC H05K 5/061 (2013.01) [H05K 1/0201 (2013.01); H05K 1/14 (2013.01); H05K 7/2039 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A cover for sealing a power module, comprising:
a first gasket that is placed along a portion of the cover that is to join with a heat sink;
a second gasket that is placed around a cutout region of an internal surface of the cover, wherein the cover couples to a circuit board associated with the power module and exposes a first component on the circuit board through the cutout region;
a first fastener that engages the cover with the heat sink;
a second fastener located on the internal surface of the cover, wherein the second fastener couples with a receiving feature of the circuit board, wherein the second fastener is surrounded by a third gasket; and
a grid-like stiffening feature on an external surface of the cover to protect the cover from impact; and
wherein a second component is mounted to the external surface of the cover via a third fastener that does not pass through a thickness of the cover.