CPC H05K 5/061 (2013.01) [H05K 1/0201 (2013.01); H05K 1/14 (2013.01); H05K 7/2039 (2013.01)] | 13 Claims |
1. A cover for sealing a power module, comprising:
a first gasket that is placed along a portion of the cover that is to join with a heat sink;
a second gasket that is placed around a cutout region of an internal surface of the cover, wherein the cover couples to a circuit board associated with the power module and exposes a first component on the circuit board through the cutout region;
a first fastener that engages the cover with the heat sink;
a second fastener located on the internal surface of the cover, wherein the second fastener couples with a receiving feature of the circuit board, wherein the second fastener is surrounded by a third gasket; and
a grid-like stiffening feature on an external surface of the cover to protect the cover from impact; and
wherein a second component is mounted to the external surface of the cover via a third fastener that does not pass through a thickness of the cover.
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