| CPC H05K 1/113 (2013.01) [H05K 3/062 (2013.01); H05K 3/4644 (2013.01); H05K 2201/096 (2013.01); H05K 2201/10674 (2013.01)] | 34 Claims |
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1. A printed circuit board comprising:
a first insulating layer;
a plurality of pads disposed on the first insulating layer; and
a plurality of insulating walls that are disposed on the first insulating layer and cover side surfaces of the plurality of pads, respectively, but are not disposed on upper surfaces of the plurality of pads,
wherein in regions outside the plurality of pads, the plurality of insulating walls are disposed to be spaced apart from each other on the first insulating layer.
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