US 11,997,787 B2
Wiring substrate and method of manufacturing wiring substrate
Hikaru Tanaka, Nagano (JP); and Takashi Kasuga, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on Jan. 11, 2022, as Appl. No. 17/573,152.
Claims priority of application No. 2021-003743 (JP), filed on Jan. 13, 2021.
Prior Publication US 2022/0225503 A1, Jul. 14, 2022
Int. Cl. H05K 1/11 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H05K 3/38 (2006.01)
CPC H05K 1/113 (2013.01) [H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H05K 3/381 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A wiring substrate comprising:
a wiring layer;
an insulating layer that is laminated on the wiring layer;
an opening portion that passes through the insulating layer to the wiring layer; and
an electric conductor film that is formed at the opening portion of the insulating layer, wherein
a surface of the insulating layer includes
a smoothed portion that is not covered by the electric conductor film, and
a roughened portion that is covered by the electric conductor film and that has surface roughness that is greater than surface roughness of the smoothed portion,
the roughened portion is provided on the surface of the insulating layer around the opening portion and on an inner wall surface of the opening portion,
the electric conductor film includes
a first electric conductor film that covers the surface of the insulating layer around the opening portion, the inner wall surface of the opening portion and a surface of the wiring layer that is exposed from the opening portion, and
a second electric conductor film that is laminated on the first electric conductor film, and
a side surface of the first electric conductor film on the surface of the insulating layer around the opening portion is located farther inward than a periphery of the roughened portion on the surface of the insulating layer around the opening portion and a side surface of the second electric conductor film.