US 11,997,781 B2
Thermal-control system of a mesh network device and associated mesh network devices
Ihab A. Ali, Cupertino, CA (US); and Frédéric Heckmann, Taipei (TW)
Assigned to Google LLC, Mountain View, CA (US)
Appl. No. 17/767,683
Filed by Google LLC, Mountain View, CA (US)
PCT Filed Oct. 8, 2020, PCT No. PCT/US2020/054810
§ 371(c)(1), (2) Date Apr. 8, 2022,
PCT Pub. No. WO2021/072096, PCT Pub. Date Apr. 15, 2021.
Claims priority of provisional application 62/913,904, filed on Oct. 11, 2019.
Prior Publication US 2023/0139054 A1, May 4, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 7/20 (2006.01); H05K 9/00 (2006.01)
CPC H05K 1/0203 (2013.01) [H05K 7/202 (2013.01); H05K 7/20509 (2013.01); H05K 9/0024 (2013.01); H05K 7/20154 (2013.01); H05K 7/2039 (2013.01); H05K 2201/09027 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a printed circuit board, the printed circuit board generally circular about a central axis and populated with one or more integrated circuit devices;
a thermal-control system to transfer heat generated by the one or more integrated circuit devices to a housing component of the apparatus for external dissipation, the thermal-control system comprising:
a heat sink, the heat sink generally cylindrical and centered about the central axis, the heat sink including an interior disk-like body that is substantially orthogonal to the central axis and in thermal contact with at least one of the one or more integrated circuit devices;
a first heat spreader, the first heat spreader generally planar and attached to a first surface of the interior disk-like body; and
a heat shield, the heat shield facing a second surface of the interior disk-like body that is opposite the first surface.
 
11. An apparatus comprising:
a housing component, the housing component including an internal cavity region that is generally concave and symmetrical about a central axis;
a thermal-control system within the housing component, the thermal-control system configured to transfer heat generated by one or more integrated circuit devices to the housing component of the apparatus for external dissipation, the thermal-control system comprising:
a heat sink that is generally cylindrical and centered about the central axis, the heat sink including an interior disk-like body that:
is substantially orthogonal to the central axis;
includes a first surface that faces the internal cavity region; and
is in thermal contact with at least one of the one or more integrated circuit devices;
a fan mechanism located between the first surface and the internal cavity region, the fan mechanism having one or more blades configured to rotate about the central axis; and
a first heat spreader that is:
generally planar;
attached to the first surface; and
located between the one or more blades of the fan mechanism and the first surface of the heat sink.