US 11,996,815 B2
Termination impedance isolation for differential transmission and related systems, methods and apparatuses
Steven Vida, Reading, PA (US); and David Gammie, Chandler, AZ (US)
Assigned to Microchip Technology Incorporated, Chandler, AZ (US)
Filed by Microchip Technology Incorporated, Chandler, AZ (US)
Filed on Nov. 24, 2021, as Appl. No. 17/456,432.
Claims priority of provisional application 63/198,962, filed on Nov. 25, 2020.
Prior Publication US 2022/0166411 A1, May 26, 2022
Int. Cl. H03H 11/28 (2006.01)
CPC H03H 11/28 (2013.01) 18 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a differential signal path portion;
a first circuit arranged at the differential signal path portion to set a differential impedance of the differential signal path portion; and
a second circuit arranged outside of the differential signal path portion to set a common-mode impedance of the differential signal path portion lower than the differential impedance.