US 11,996,505 B2
Vacuum injection molding for optoelectronic modules
Ji Wang, Singapore (SG); Kam Wah Leong, Singapore (SG); QiChuan Yu, Singapore (SG); Simon Gubser, Weesen (CH); and Yoong Kheng Teoh, Singapore (SG)
Assigned to AMS Sensors Singapore PTE. LTD., Singapore (SG)
Appl. No. 17/294,749
Filed by ams Sensors Singapore Pte. Ltd., Singapore (SG)
PCT Filed Nov. 27, 2019, PCT No. PCT/SG2019/050580
§ 371(c)(1), (2) Date May 18, 2021,
PCT Pub. No. WO2020/122813, PCT Pub. Date Jun. 18, 2020.
Claims priority of provisional application 62/777,407, filed on Dec. 10, 2018.
Prior Publication US 2022/0020901 A1, Jan. 20, 2022
Int. Cl. B29C 45/34 (2006.01); B29C 33/12 (2006.01); B29C 70/88 (2006.01); B29C 71/02 (2006.01); B29C 71/04 (2006.01); B29D 11/00 (2006.01); H01L 25/16 (2023.01); H01L 33/56 (2010.01); B29C 45/00 (2006.01); B29C 45/14 (2006.01); B29K 63/00 (2006.01); B29L 31/34 (2006.01); H05K 3/28 (2006.01)
CPC H01L 33/56 (2013.01) [B29C 33/12 (2013.01); B29D 11/00307 (2013.01); B29D 11/00807 (2013.01); H01L 25/167 (2013.01); B29C 2045/0075 (2013.01); B29C 45/14065 (2013.01); B29C 2045/14114 (2013.01); B29C 45/14639 (2013.01); B29C 2791/006 (2013.01); B29K 2063/00 (2013.01); B29L 2031/34 (2013.01); B29L 2031/3425 (2013.01); H01L 2933/005 (2013.01); H05K 3/284 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method comprising:
supporting a printed circuit board substrate on a first vacuum injection tool, the printed circuit board substrate having at least one optoelectronic component mounted thereon and having a solder mask on a surface facing away from the first vacuum injection tool;
causing the first vacuum injection tool and a second vacuum injection tool to be brought closer to one another such that a surface of the second vacuum injection tool is in contact with the solder mask; and
subsequently providing a first epoxy, using a vacuum injection technique, in spaces between the second vacuum injection tool and the solder mask;
wherein the printed circuit board substrate covers an area of at least 0.4 times an area of the first vacuum injection tool on which the printed circuit board substrate is supported; and
wherein the printed circuit board substrate and the first vacuum injection tool have an x-dimension and a y-dimension and wherein each of the x-dimension and the y-dimension of the printed circuit board substrate is smaller than a corresponding x-dimension and y-dimension of the first vacuum injection tool.