US 11,996,502 B2
Method of manufacturing light-emitting device including step of curing sealing member while applying centrifugal force
Kenji Ozeki, Tokushima (JP); Atsushi Kojima, Tokushima (JP); and Chinami Nakai, Anan (JP)
Assigned to NICHIA CORPORATION, Anan (JP)
Filed by NICHIA CORPORATION, Anan (JP)
Filed on Mar. 13, 2020, as Appl. No. 16/817,796.
Claims priority of application No. 2019-048979 (JP), filed on Mar. 15, 2019.
Prior Publication US 2020/0295242 A1, Sep. 17, 2020
Int. Cl. H01L 33/52 (2010.01); H01L 33/00 (2010.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01)
CPC H01L 33/52 (2013.01) [H01L 33/005 (2013.01); H01L 33/502 (2013.01); H01L 33/54 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 2933/005 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A method of producing a light-emitting device, the method comprising:
providing a lead frame comprising a plurality of package portions that are connected together, each package portion having an upper surface and a recess including an opening located at the upper surface;
disposing, in each package portion, a light-emitting element on a surface that defines a bottom of the recess;
disposing an uncured light reflective member in the recess of each package portion;
curing the uncured light reflective members, thereby forming a cured light reflective member in the recess of each package portion;
after forming the cured light reflective member in the recess of each package portion, disposing an uncured sealing member in the recess of each package portion;
applying a centrifugal force to the lead frame, with the uncured sealing member disposed in each recess, wherein the centrifugal force is applied to each package portion in a direction toward the surface that defines the bottom of the recess, and wherein the centrifugal force causes a part of an upper surface of each uncured sealing member to be formed into a flat region; and
curing the uncured sealing members while applying the centrifugal force to the lead frame such that the flat region of the upper surface of each uncured sealing member is maintained, thereby forming, in the recess of each package portion, a cured sealing member having an upper surface that includes a flat region; wherein:
in the steps of applying the centrifugal force and curing the uncured sealing members, the lead frame is deformed by the centrifugal force while the centrifugal force is applied to the lead frame; and
the flat region of the upper surface of each cured sealing member is located below the upper surface of the corresponding package portion.