US 11,996,456 B2
Assemblies which include ruthenium-containing conductive gates
Ramanathan Gandhi, Singapore (SG)
Filed by Lodestar Licensing Group LLC, Evanston, IL (US)
Filed on Apr. 28, 2023, as Appl. No. 18/140,757.
Application 17/194,791 is a division of application No. 16/383,964, filed on Apr. 15, 2019, granted, now 10,964,793, issued on Mar. 30, 2021.
Application 18/140,757 is a continuation of application No. 17/194,791, filed on Mar. 8, 2021, granted, now 11,717,287.
Prior Publication US 2023/0255625 A1, Aug. 17, 2023
Int. Cl. H01L 29/423 (2006.01); A61B 17/068 (2006.01); A61B 17/072 (2006.01); A61B 17/10 (2006.01); H01L 29/49 (2006.01); H10B 43/10 (2023.01); H10B 43/27 (2023.01); A61B 17/00 (2006.01); A61B 17/29 (2006.01); A61B 90/00 (2016.01)
CPC H01L 29/4234 (2013.01) [A61B 17/068 (2013.01); A61B 17/07207 (2013.01); A61B 17/105 (2013.01); H01L 29/4958 (2013.01); H10B 43/10 (2023.02); H10B 43/27 (2023.02); A61B 2017/00473 (2013.01); A61B 17/072 (2013.01); A61B 2017/07257 (2013.01); A61B 2017/07271 (2013.01); A61B 2017/07278 (2013.01); A61B 2017/07285 (2013.01); A61B 2017/2927 (2013.01); A61B 2090/0814 (2016.02)] 21 Claims
OG exemplary drawing
 
1. A method of forming an integrated assembly, comprising:
forming a stack comprising alternating first and second materials; the second material being an insulative material;
forming openings through the stack;
forming channel-material-pillars in some of the openings and leaving other openings empty;
removing the first material to leave voids;
forming conductive liners along the empty openings; and
while the conductive liners remain, filling the voids with conductive material.