US 11,996,420 B2
Image sensor comprising a grid pattern and a conductive pattern
Han Seok Kim, Seoul (KR); Byung Jun Park, Yongin-si (KR); Hyeon Ho Kim, Hwaseong-si (KR); and Young Woo Chung, Yongin-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Aug. 18, 2021, as Appl. No. 17/405,517.
Claims priority of application No. 10-2020-0128468 (KR), filed on Oct. 6, 2020.
Prior Publication US 2022/0109016 A1, Apr. 7, 2022
Int. Cl. H01L 27/146 (2006.01)
CPC H01L 27/14603 (2013.01) [H01L 27/14621 (2013.01); H01L 27/14627 (2013.01); H01L 27/1463 (2013.01); H01L 27/14636 (2013.01); H01L 27/1464 (2013.01); H01L 27/14645 (2013.01); H01L 27/14683 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An image sensor comprising:
a substrate including an active pixel sensor region, an optical black sensor region, and a boundary region provided between the active pixel sensor region and the optical black sensor region;
a photoelectric conversion element provided inside the substrate on the boundary region;
a passivation layer provided on the substrate;
a grid trench formed on the boundary region of the substrate, the grid trench comprising an inclined surface that extends from an upper surface of the passivation layer toward an inside of the passivation layer;
grid patterns, each of grid patterns being provided on the passivation layer on each of the active pixel sensor region and the boundary region of the substrate, at least a part of a grid pattern being provided inside the grid trench on the inclined surface such that a cross section view of the at least a part of the grid pattern includes a triangular shaped portion; and
a color filter provided between the grid patterns.