US 11,996,400 B2
Manufacturing method of package on package structure
Hsuan-Ting Kuo, Taichung (TW); Ching-Hua Hsieh, Hsinchu (TW); Cheng-Ting Chen, Taichung (TW); Hsiu-Jen Lin, Hsinchu County (TW); Hao-Jan Pei, Hsinchu (TW); Yu-Peng Tsai, Taipei (TW); Chia-Lun Chang, Tainan (TW); Chih-Chiang Tsao, Taoyuan (TW); and Philip Yu-Shuan Chung, Taipei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Apr. 27, 2022, as Appl. No. 17/731,240.
Application 17/731,240 is a continuation of application No. 16/740,463, filed on Jan. 12, 2020, granted, now 11,342,321.
Application 16/740,463 is a continuation of application No. 16/059,052, filed on Aug. 9, 2018, granted, now 10,535,644, issued on Jan. 14, 2020.
Claims priority of provisional application 62/691,628, filed on Jun. 29, 2018.
Prior Publication US 2022/0254767 A1, Aug. 11, 2022
Int. Cl. H01L 25/10 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/522 (2006.01); H01L 25/00 (2006.01); H01L 27/06 (2006.01)
CPC H01L 25/50 (2013.01) [H01L 21/56 (2013.01); H01L 21/6836 (2013.01); H01L 21/76871 (2013.01); H01L 23/3128 (2013.01); H01L 23/5226 (2013.01); H01L 24/17 (2013.01); H01L 24/33 (2013.01); H01L 27/0688 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/02373 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
mounting top packages on a top side of a reconstructed wafer over a flexible tape, wherein conductive bumps at a bottom side of the reconstructed wafer is attached to the flexible tape, wherein during the mounting, a shape geometry of the respective conductive bump changes and at least a lower portion of the respective conductive bump is embraced by the flexible tape; and
releasing the flexible tape from the conductive bumps after the mounting.