US 11,996,395 B2
Display device and manufacturing method thereof
Jin Woo Choi, Yongin-si (KR); Min Woo Kim, Yongin-si (KR); Dae Ho Song, Yongin-si (KR); and Hyung Il Jeon, Yongin-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Appl. No. 17/285,328
Filed by SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
PCT Filed Dec. 13, 2018, PCT No. PCT/KR2018/015851
§ 371(c)(1), (2) Date Apr. 14, 2021,
PCT Pub. No. WO2020/080603, PCT Pub. Date Apr. 23, 2020.
Claims priority of application No. 10-2018-0122800 (KR), filed on Oct. 15, 2018.
Prior Publication US 2021/0384180 A1, Dec. 9, 2021
Int. Cl. H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01)
CPC H01L 25/167 (2013.01) [H01L 21/6835 (2013.01); H01L 24/95 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/95001 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method of manufacturing a display device, comprising:
disposing a plurality of light emitting elements on a first transfer film;
stretching the first transfer film so that the plurality of light emitting elements are spaced apart from each other;
transferring the plurality of light emitting elements onto a thin film transistor array substrate; and
removing the first transfer film from the plurality of light emitting elements, wherein
the thin film transistor array substrate comprises a transistor on a substrate, a planarization layer on the transistor, and a first electrode on the planarization layer,
the plurality of light emitting elements are transferred onto the first electrode,
the first electrode is formed on an entire area of a pixel area of the thin film transistor array substrate, and
the transferring occurring absent an alignment of the light emitting elements with elements on the thin film transistor array substrate.