US 11,996,382 B2
Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, semiconductor device using the same, and manufacturing method thereof
Mitsuo Takada, Saga (JP); Nanako Maeda, Saga (JP); Osamu Matsuzawa, Saga (JP); Ryo Ishikawa, Saga (JP); and Takuya Kobayashi, Saga (JP)
Assigned to TANAKA DENSHI KOGYO K. K., Kanzaki-gun (JP)
Filed by TANAKA DENSHI KOGYO K. K., Saga (JP)
Filed on Nov. 30, 2021, as Appl. No. 17/537,719.
Application 17/537,719 is a continuation of application No. PCT/JP2020/010118, filed on Mar. 9, 2020.
Claims priority of application No. 2019-104652 (JP), filed on Jun. 4, 2019.
Prior Publication US 2022/0122937 A1, Apr. 21, 2022
Int. Cl. H01L 23/00 (2006.01); C22C 9/00 (2006.01); C22F 1/08 (2006.01); H01L 23/498 (2006.01)
CPC H01L 24/45 (2013.01) [C22C 9/00 (2013.01); C22F 1/08 (2013.01); H01L 24/43 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); C22C 2204/00 (2013.01); H01L 23/49805 (2013.01); H01L 23/49816 (2013.01); H01L 2224/4321 (2013.01); H01L 2224/43825 (2013.01); H01L 2224/43848 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45572 (2013.01); H01L 2224/45644 (2013.01); H01L 2224/45664 (2013.01); H01L 2224/48011 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48453 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/85045 (2013.01); H01L 2924/3512 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A palladium-coated copper bonding wire, comprising: a core material containing copper as a main component; and a palladium layer on the core material,
wherein a concentration of palladium relative to the entire wire is 1.0 mass % or more and 4.0 mass % or less, and
a work hardening coefficient in a range of an elongation rate of 2% or more and a maximum elongation rate of ε max % or less, is 0.20 or less.