US 11,996,381 B2
Package structure and method of fabricating the same
Hui-Jung Tsai, Hsinchu (TW); Hung-Jui Kuo, Hsinchu (TW); and Jyun-Siang Peng, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Dec. 12, 2022, as Appl. No. 18/079,854.
Application 18/079,854 is a continuation of application No. 17/106,161, filed on Nov. 29, 2020, granted, now 11,557,561.
Application 17/106,161 is a continuation of application No. 16/027,275, filed on Jul. 4, 2018, granted, now 10,854,570, issued on Dec. 1, 2020.
Claims priority of provisional application 62/537,946, filed on Jul. 27, 2017.
Prior Publication US 2023/0111006 A1, Apr. 13, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 23/498 (2006.01)
CPC H01L 24/25 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/24 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 23/49816 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/24155 (2013.01); H01L 2224/24265 (2013.01); H01L 2224/2501 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73209 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81355 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/18161 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A structure, comprising:
an electronic component including conductive pads and conductive pillars disposed on the conductive pads;
through vias surrounding the electronic component;
a redistribution structure electrically connected to the electronic component and the through vias, wherein the redistribution structure comprises:
a plurality of conductive vias, wherein each of the plurality of conductive vias has a first surface and a second surface, the first surface has a greater surface area than the second surface, the conductive pillars of the electronic component and the through vias are physically joined with the first surface of the plurality of conductive vias, and wherein the conductive pillars are sandwiched between the conductive pads and the plurality of conductive vias; and
a plurality of conductive wirings, wherein the second surface of each of the plurality of conductive vias is physically joined to one of the plurality of conductive wirings.