US 11,996,369 B2
Semiconductor devices and methods of manufacturing semiconductor devices
Myung Jea Choi, Incheon (KR); Gyu Wan Han, Incheon (KR); Gi Tae Lim, Incheon (KR); Dong Joo Park, Incheon (KR); Ji Hun Yi, Incheon (KR); and Jin Young Khim, Seoul (KR)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed on Oct. 25, 2022, as Appl. No. 17/973,057.
Application 17/973,057 is a continuation of application No. 17/073,025, filed on Oct. 16, 2020, granted, now 11,482,496, issued on Oct. 25, 2022.
Prior Publication US 2023/0110213 A1, Apr. 13, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/5389 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/5383 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 2224/214 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a first substrate comprising a first conductive structure;
a first electronic component coupled to a bottom side of the first substrate;
a vertical interconnect coupled to the bottom side of the first substrate and located external to the first electronic component; and
an encapsulant covering the vertical interconnect, a first lateral side of the first electronic component, and at least a portion of the bottom side of the first substrate;
wherein a vertical port on the first electronic component is exposed by an aperture of the first substrate.