| CPC H01L 23/5384 (2013.01) [H01L 23/16 (2013.01); H01L 23/31 (2013.01); H01L 23/5385 (2013.01); H01L 25/0652 (2013.01)] | 15 Claims |
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1. A semiconductor package, comprising:
a first package, the first package including a first package substrate, a first semiconductor chip on the first package substrate, and a first molding part on the first package substrate and covering the first semiconductor chip;
a second package on the first package, the second package including a second package substrate, second and third semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the second and third semiconductor chips;
an interposer substrate between the first molding part and the second package substrate; and
an under-fill part that fills a space between the interposer substrate and the first molding part,
the interposer substrate comprises a first through hole that penetrates the interposer substrate,
the under-fill part extends from the space between the interposer substrate and the first molding part to a space between the interposer substrate and the second package substrate through the first through hole,
wherein the second package substrate comprises a second through hole that penetrates the second package substrate, and
wherein the under-till part extends into the second through hole.
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