US 11,996,350 B2
Cooler and semiconductor apparatus
Yoshihiro Tateishi, Kawasaki (JP); Takahiro Koyama, Kawasaki (JP); and Hiromichi Gohara, Kawasaki (JP)
Assigned to FUJI ELECTRIC CO., LTD., Kawasaki (JP)
Filed by FUJI ELECTRIC CO., LTD., Kawasaki (JP)
Filed on Jul. 30, 2021, as Appl. No. 17/389,911.
Claims priority of application No. 2020-154764 (JP), filed on Sep. 15, 2020.
Prior Publication US 2022/0084904 A1, Mar. 17, 2022
Int. Cl. H01L 23/473 (2006.01); H01L 25/07 (2006.01); H05K 7/20 (2006.01)
CPC H01L 23/473 (2013.01) [H01L 25/072 (2013.01); H05K 7/20927 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A cooler, comprising; a top plate having a first surface forming a heat dissipation surface and a second surface on which a semiconductor device to be disposed; a plurality of fins provided on the heat dissipation surface of the top plate; a circumferential wall part provided along outer circumferential edges of the top plate so as to surround the plurality of fins; and a bottom plate bonded to ends of the circumferential wall part and the plurality of fins at a side opposite to a side where the top plate is disposed, the bottom plate having an inlet portion and a discharge portion for a coolant, the inlet portion and the discharge portion being disposed so as to face each other diagonally with the plurality fins interposed therebetween, wherein a flow path for the coolant is formed by a space enclosed by the top plate, the circumferential wall part and the bottom plate, an inner surface of the circumferential wall part has a step part at a position neighboring the discharge portion, the step part having a tilted surface so as to gradually increase a distance between the discharge portion and the tilted surface along the flow path at an area where the discharge portion is disposed, and
the space forming the flow pass has a first header part leading to the inlet portion, a fin accommodating part accommodating the plurality of fins, and a second header part leading to the discharge portion, and the first header part and the second header part are disposed so as to face each other with the fin accommodating part interposed therebetween;
the cooler further comprising a plurality of guide walls that respectively guide a flow of the coolant in the first header part and the second header part.