a first heat dissipation plate having a first upper surface and a first lower surface, wherein the first heat dissipation plate comprises first through holes, and each of the first through holes is extended from the first upper surface to the first lower surface;

a second heat dissipation plate having a second upper surface and a second lower surface, wherein the second heat dissipation plate comprises second through holes, and each of the second through holes is extended from the second upper surface to the second lower surface and respectively aligned with one of the first through holes;

a plurality of heat generating assemblies disposed between the first heat dissipation plate and the second heat dissipation plate, wherein each of the heat generating assemblies comprises a semiconductor die disposed on the second lower surface; and

a plurality of fixture components, comprising fix screws and nuts, wherein the fix screws respectively comprise screw heads and thread portions connected with each other, and the fix screws penetrate through the first heat dissipation plate and the second heat dissipation plate along the first through holes and the second through holes,

wherein the thread portions of the fix screws are respectively threaded through the nuts and protruded therefrom along a direction away from the first lower surface, and the screw heads are pressed against the second upper surface to fixedly secure the heat generating assemblies between the first heat dissipation plate and the second heat dissipation plate,

wherein each of the heat generating assemblies further comprises a voltage regulator module disposed on the first upper surface and between the semiconductor die and the first heat dissipation plate,

wherein the voltage regulator modules respectively have different heights along a stacking direction of the first heat dissipation plate and the second heat dissipation plate.