US 11,996,337 B2
Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
Kazuyoshi Yamamoto, Toyama (JP); Hidemoto Hayashihara, Toyama (JP); Kayoko Yashiki, Toyama (JP); and Kazuhide Asai, Toyama (JP)
Assigned to KOKUSAI ELECTRIC CORPORATION, Tokyo (JP)
Filed by Kokusai Electric Corporation, Tokyo (JP)
Filed on Jun. 9, 2022, as Appl. No. 17/836,631.
Application 17/836,631 is a continuation of application No. 17/484,101, filed on Sep. 24, 2021, granted, now 11,387,152.
Claims priority of application No. 2021-119835 (JP), filed on Jul. 20, 2021.
Prior Publication US 2023/0027653 A1, Jan. 26, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/66 (2006.01); H01L 21/67 (2006.01)
CPC H01L 22/20 (2013.01) [H01L 21/67248 (2013.01); H01L 21/67253 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a process chamber in which substrate processing is executed;
a memory that stores recipe information describing a procedure that executes the substrate processing, process data measured during executing processing of a substrate in the process chamber, data calculated from the process data, and comparison data to be compared with the data; and
a calculator configured to be capable of comparing the data with the comparison data to obtain an index indicating a reproducibility of the comparison data, and calculating a value of setting information included in the recipe information when the index is smaller than a predetermined value.