US 11,996,312 B2
Electrostatic chuck
Joaquin Aguilar Santillan, Gilbert, AZ (US); Hong Gao, San Jose, CA (US); and Shanker Kuttath, Austin, TX (US)
Assigned to ASM IP Holding B.V., Almere (NL)
Filed by ASM IP Holding B.V., Almere (NL)
Filed on Jan. 6, 2022, as Appl. No. 17/570,232.
Claims priority of provisional application 63/136,086, filed on Jan. 11, 2021.
Prior Publication US 2022/0223453 A1, Jul. 14, 2022
Int. Cl. H01T 23/00 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H05B 3/12 (2006.01); H05B 3/18 (2006.01)
CPC H01L 21/6833 (2013.01) [H01L 21/67103 (2013.01); H05B 3/12 (2013.01); H05B 3/18 (2013.01); H05B 2203/017 (2013.01)] 20 Claims
OG exemplary drawing
 
11. A method of forming an electrostatic chuck, the method comprising the steps of:
providing ceramic precursor material within a mold;
providing a device;
coating the device with an interface material to form a coated device;
placing the coated device on or within the ceramic precursor material; and
sintering the ceramic precursor material to form the electrostatic chuck,
wherein the interface material forms an interface layer between the device and ceramic material formed during the step of sintering.