CPC H01L 21/6833 (2013.01) [H01L 21/67103 (2013.01); H05B 3/12 (2013.01); H05B 3/18 (2013.01); H05B 2203/017 (2013.01)] | 20 Claims |
11. A method of forming an electrostatic chuck, the method comprising the steps of:
providing ceramic precursor material within a mold;
providing a device;
coating the device with an interface material to form a coated device;
placing the coated device on or within the ceramic precursor material; and
sintering the ceramic precursor material to form the electrostatic chuck,
wherein the interface material forms an interface layer between the device and ceramic material formed during the step of sintering.
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