US 11,996,242 B2
Multilayer capacitor
Byeong Guk Choi, Suwon-si (KR); Dong Yeong Kim, Suwon-si (KR); Chung Hyeon Ryu, Suwon-si (KR); and Seung Been Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Apr. 6, 2022, as Appl. No. 17/714,710.
Claims priority of application No. 10-2021-0187060 (KR), filed on Dec. 24, 2021.
Prior Publication US 2023/0207207 A1, Jun. 29, 2023
Int. Cl. H01G 4/30 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A multilayer capacitor comprising:
a body including a dielectric layer and a plurality of internal electrodes stacked on each other having the dielectric layer interposed therebetween; and
external electrodes each including:
an electrode layer positioned externally on the body and connected to the plurality of internal electrodes, and,
a resin electrode layer covering the electrode layer, the resin electrode layer including a resin layer and metal particles dispersed in the resin layer,
wherein the body includes a first surface and a second surface, opposing each other, and from which the plurality of internal electrodes extend, and a third surface and a fourth surface which are connected to the first surface and the second surface, and oppose each other in a direction in which the plurality of internal electrodes are stacked on each other,
the electrode layer includes a first region covering the first or second surface and a second region covering the third or fourth surface and having surface roughness lower than that of the first region, and
a portion of the resin electrode layer adjacent to the first region has a surface roughness lower than that of the first region.