US 11,996,227 B2
Hexagonal semiconductor package structure
Tzu-Sung Huang, Tainan (TW); Chen-Hua Yu, Hsinchu (TW); Hao-Yi Tsai, Hsinchu (TW); Hung-Yi Kuo, Taipei (TW); and Ming Hung Tseng, Toufen Township (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Dec. 13, 2022, as Appl. No. 18/065,199.
Application 16/734,776 is a division of application No. 15/232,443, filed on Aug. 9, 2016, granted, now 10,530,175, issued on Jan. 7, 2020.
Application 18/065,199 is a continuation of application No. 16/734,776, filed on Jan. 6, 2020, granted, now 11,532,425.
Prior Publication US 2023/0116861 A1, Apr. 13, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01F 27/28 (2006.01); H01F 38/14 (2006.01); H01F 41/04 (2006.01); H01F 41/10 (2006.01); H01L 49/02 (2006.01); H02J 50/10 (2016.01); H02J 50/80 (2016.01); H01F 17/00 (2006.01)
CPC H01F 27/2804 (2013.01) [H01F 38/14 (2013.01); H01F 41/041 (2013.01); H01F 41/10 (2013.01); H01L 28/10 (2013.01); H02J 50/10 (2016.02); H02J 50/80 (2016.02); H01F 2017/0086 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system comprising:
a first insulating layer comprising a first material;
a plurality of coils embedded in the first insulating layer, each coil of the plurality of coils comprising a conductive element that forms a continuous spiral having a hexagonal shape in a plan view of the plurality of coils, wherein a minimum distance between adjacent coils of the plurality of coils is between 200 μm and 250 μm, and wherein the plurality of coils are arranged in a honeycomb pattern;
a first dielectric layer on a first surface of the first insulating layer; the first dielectric layer comprising a second material different than the first material;
a second dielectric layer on a second surface of the first insulating layer, the second dielectric layer being in physical contact with the plurality of coils, the second dielectric layer comprising the second material; and
a plurality of electrical connectors extending through the second dielectric layer and electrically contacting the plurality of coils, wherein widths of the plurality of electrical connectors decrease as the plurality of electrical connectors extend through the second dielectric layer toward the plurality of coils.