CPC G06F 3/016 (2013.01) [G06F 3/03547 (2013.01); G06F 3/044 (2013.01); G06F 2203/04103 (2013.01)] | 20 Claims |
1. A modular seamless haptic touchpad assembly for an information handling system comprising:
a seamless glass layer forming a top layer of a touchpad and extending to a plurality of palm rest support surfaces formed over a touchpad support bracket to extend across a top cover of a base chassis when installed in the information handling system;
a touch sensing layer adhesively coupled to a bottom surface of the seamless glass layer;
a touchpad printed circuit board assembly (PCBA) operatively coupled to a bottom surface of the touch sensing layer;
a haptic actuator array coupled between a bottom surface of the PCBA and the touchpad support bracket for generating haptic user feedback to a user of the touchpad; and
the touchpad support bracket formed under the haptic actuator array to support the modular seamless haptic touchpad assembly as an installable hardware module, the touchpad support bracket formed to modularly fit within a touchpad opening formed in the top cover of the base chassis of the information handling system; and
a connector port to operatively couple a haptic touchpad controller with a reciprocal connector in the touchpad opening formed in the top cover of the base chassis and the modular seamless touchpad assembly is testable as the installable hardware module via the connector port before installation in the top cover of the base chassis;
wherein the touchpad support bracket is mechanically and operatively couplable within the base chassis of the information handling system via fasteners disposed through the base chassis of the information handling system and into receiver openings along the sides of the touchpads support bracket.
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