US 11,994,440 B2
High temperature protected wire bonded sensors
Alexander A. Ned, Kinnelon, NJ (US); Leo Geras, Pearl River, NY (US); and Sorin Stefanescu, New Milford, NJ (US)
Assigned to KULITE SEMICONDUCTOR PRODUCTS, INC., Leonia, NJ (US)
Filed by KULITE SEMICONDUCTOR PRODUCTS, INC., Leonia, NJ (US)
Filed on Oct. 26, 2020, as Appl. No. 17/079,696.
Application 17/079,696 is a continuation of application No. 16/552,172, filed on Aug. 27, 2019, granted, now 10,871,415.
Application 16/552,172 is a continuation of application No. 15/667,117, filed on Aug. 2, 2017, granted, now 10,436,662.
Prior Publication US 2021/0041318 A1, Feb. 11, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. G01L 19/00 (2006.01); G01L 9/00 (2006.01); G01L 19/06 (2006.01); G01L 19/14 (2006.01)
CPC G01L 19/0681 (2013.01) [G01L 9/0042 (2013.01); G01L 9/0044 (2013.01); G01L 9/0048 (2013.01); G01L 9/0054 (2013.01); G01L 19/0069 (2013.01); G01L 19/0084 (2013.01); G01L 19/0627 (2013.01); G01L 19/147 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A sensor device, comprising:
a header;
one or more electrically conductive feedthrough pins extending completely through corresponding apertures in the header;
electrically conductive pin inserts surrounding and in electrical communication with at least a portion of the corresponding one or more feedthrough pins and extending completely through the corresponding apertures in the header, the one or more pin inserts secured to the header by electrically isolating seals, wherein the one or more pin inserts each comprise a metal cylinder having an open end and a closed end;
a sensor chip disposed on the header, the sensor chip comprising one or more contact pads and a pressure-sensitive portion;
wire bonded interconnections electrically connecting the one or more contact pads with the respective one or more feedthrough pins;
an outer cover comprising a diaphragm protrusion in mechanical communication with the pressure-sensitive portion of the sensor chip; and
a sealed enclosure formed by the header and the outer cover, the sealed enclosure isolating at least the wire bonded interconnections, the one or more contact pads, and the sensor chip from an external environment; wherein the open end of each pin insert is configured to accept a respective feedthrough pin, and wherein the closed end of each pin insert extends outside of the header and is configured to at least partially seal the enclosure and to enable electrical connections on both ends of the one or more feedthrough pins.