CPC F21V 5/007 (2013.01) [F21Y 2105/00 (2013.01); F21Y 2115/10 (2016.08)] | 9 Claims |
1. An LED device applicable to a backlight module, wherein the LED device comprises:
a transparent LED frame;
an LED chip disposed at a bottom portion of the transparent LED frame;
a packaging glue layer formed inside the transparent frame and covering the LED chip; and
an anti-glare light-blocking layer disposed on the packaging glue layer, wherein the anti-glare light-blocking layer does not completely cover an upper surface of the packaging glue layer;
wherein a diffusion agent is distributed in the packaging glue layer;
wherein a surface of the packaging glue layer away from the bottom portion of the transparent LED frame is a concave surface.
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