US 11,993,740 B2
Low dielectric resin composition, molded article, film, multilayer film and flexible printed wiring board
Yuichi Imamura, Osaka (JP); Keisuke Oguma, Osaka (JP); and Masayoshi Kido, Osaka (JP)
Assigned to KANEKA CORPORATION, Osaka (JP)
Filed by KANEKA CORPORATION, Osaka (JP)
Filed on Oct. 22, 2021, as Appl. No. 17/508,218.
Application 17/508,218 is a continuation of application No. PCT/JP2020/017463, filed on Apr. 23, 2020.
Claims priority of application No. 2019-086110 (JP), filed on Apr. 26, 2019.
Prior Publication US 2022/0041932 A1, Feb. 10, 2022
Int. Cl. G02F 1/1333 (2006.01); C09K 19/02 (2006.01); C09K 19/38 (2006.01); C09K 19/54 (2006.01); H05K 1/02 (2006.01); C08F 255/02 (2006.01); C08L 51/00 (2006.01)
CPC C09K 19/38 (2013.01) [C09K 19/02 (2013.01); C09K 19/542 (2013.01); H05K 1/024 (2013.01); C08F 255/023 (2013.01); C08L 51/003 (2013.01); C09K 2219/03 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0158 (2013.01); H05K 2201/0183 (2013.01)] 11 Claims
 
1. A low dielectric resin composition comprising:
a liquid crystal polymer (A); and
a graft-modified polyolefin (B) having a polar group,
wherein the low dielectric resin composition has a sea-island structure comprising the liquid crystal polymer (A) and the graft-modified polyolefin (B) having a polar group,
wherein the sea-island structure is observed in at least one of three target regions with a size of 100 μm by 100 μm in a cross-section of the low dielectric resin composition, and
wherein the low dielectric resin composition has:
a relative permittivity lower than that of the liquid crystal polymer (A) at a frequency of 10 GHz,
a dielectric dissipation factor lower than that of the graft-modified polyolefin (B) at the frequency of 10 GHz,
a relative permittivity of 2.80 or less at the frequency of 10 GHz, and
a dielectric dissipation factor of 0.0025 or less at the frequency of 10 GHz.