US 11,993,731 B2
Adhesive composition for semiconductor circuit connection and adhesive film containing the same
Junghak Kim, Daejeon (KR); You Jin Kyung, Daejeon (KR); Kwang Joo Lee, Daejeon (KR); Minsu Jeong, Daejeon (KR); Ju Hyeon Kim, Daejeon (KR); and Youngsam Kim, Daejeon (KR)
Assigned to LG CHEM, LTD., Seoul (KR)
Appl. No. 17/266,023
Filed by LG CHEM, LTD., Seoul (KR)
PCT Filed Jun. 5, 2020, PCT No. PCT/KR2020/007338
§ 371(c)(1), (2) Date Feb. 4, 2021,
PCT Pub. No. WO2020/251219, PCT Pub. Date Dec. 17, 2020.
Claims priority of application No. 10-2019-0068110 (KR), filed on Jun. 10, 2019; and application No. 10-2020-0067603 (KR), filed on Jun. 4, 2020.
Prior Publication US 2021/0292616 A1, Sep. 23, 2021
Int. Cl. C09J 163/00 (2006.01); C08G 59/30 (2006.01); C08G 59/32 (2006.01); C08G 77/14 (2006.01); C08L 33/20 (2006.01); C08L 63/00 (2006.01); C08L 83/06 (2006.01); C09J 7/00 (2018.01); C09J 7/10 (2018.01); C09J 7/30 (2018.01); C09J 11/00 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); C09J 133/20 (2006.01); C09J 183/06 (2006.01); C09J 183/12 (2006.01)
CPC C09J 163/00 (2013.01) [C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 183/06 (2013.01); C09J 2203/326 (2013.01)] 8 Claims
OG exemplary drawing
 
1. An adhesive composition for semiconductor circuit connection, comprising a thermosetting resin containing an organic epoxy resin and an organic-inorganic hybrid epoxy resin having a repeating unit represented by Chemical Formula 1, wherein a weight ratio of the organic epoxy resin to the organic-inorganic hybrid epoxy resin having a repeating unit represented by Chemical Formula 1 in the thermosetting resin is the range of 1:0.03 to 1:4.0,
wherein the organic epoxy resin contains (a1) an organic epoxy resin that is solid at 10 to 35° C., and (a2) an organic epoxy resin that is liquid at 10 to 35° C.,
wherein
a weight ratio of (a1):[(a2)+(a3)] is 1:0.15 to 1:2.7, and
a weight ratio of (a2):(a3) is 1:0.15 to 1:10,
wherein (a3) is the organic-inorganic hybrid epoxy resin,
wherein the adhesive composition further comprises a thermoplastic resin, a curing agent, an inorganic filler, and a curing catalyst,
wherein the thermoplastic resin is a (meth)acrylate-based resin having a (meth)acrylate-based repeating unit containing an epoxy-based functional group,
wherein the thermoplastic resin is included in an amount of 53 parts by weight to 70 parts by weight, the curing agent is included in an amount of 10 parts by weight to 150 parts by weight, the inorganic filler is included in an amount of 5 parts by weight to 200 parts by weight, and the curing agent catalyst is included in an amount of 0.1 to 20 parts by weight, based on 100 parts by weight of the thermosetting resin, and
wherein the organic-inorganic hybrid epoxy resin has an average epoxy equivalent weight of 50 g/eq. to 174 g/eq.:

OG Complex Work Unit Chemistry
in the Chemical Formula 1,
R is each independently a monovalent functional group having at least one epoxy group, and
n is 1 to 30.