US 11,993,026 B2
Multi-functional interface/surface layer for thermoplastic components
Wenping Zhao, Glastonbury, CT (US); Lei Xing, East Hartford, CT (US); Danielle Grolman, Holden, MA (US); Orlando Mijares, Tucson, AZ (US); Mary K. Herndon, Littleton, MA (US); and Sridhar Siddhamalli, Tucson, AZ (US)
Assigned to Raytheon Company, Tewksbury, MA (US)
Filed by Raytheon Company, Waltham, MA (US)
Filed on Feb. 10, 2021, as Appl. No. 17/172,523.
Prior Publication US 2022/0250334 A1, Aug. 11, 2022
Int. Cl. B32B 27/00 (2006.01); B29C 65/00 (2006.01); B29C 65/02 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); B32B 27/36 (2006.01)
CPC B29C 66/73116 (2013.01) [B29C 65/02 (2013.01); B29C 66/712 (2013.01); B29C 66/721 (2013.01); B29C 66/7311 (2013.01); B32B 27/08 (2013.01); B32B 27/288 (2013.01); B32B 27/365 (2013.01); B29C 66/70 (2013.01); B32B 2250/03 (2013.01); B32B 2250/24 (2013.01); B32B 2307/30 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A process for welding an attachment to a component with an interface layer comprising:
providing the attachment comprising a first thermoplastic material;
providing the component comprising a second thermoplastic material having a melting point temperature of greater than 25 degrees Centigrade different from a melting point temperature of the first thermoplastic material; and
welding an interface layer between the attachment and the component; wherein the interface layer is configured to join the first thermoplastic material and the second thermoplastic material together to form a weld, wherein said interface layer comprises a melting point temperature having a value selected from the group consisting of between the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer; or lower than the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer.