US 11,992,915 B2
System for adjusting pad surface temperature and polishing apparatus
Shuji Uozumi, Tokyo (JP); Toru Maruyama, Tokyo (JP); and Mitsunori Komatsu, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Filed by EBARA CORPORATION, Tokyo (JP)
Filed on Dec. 8, 2020, as Appl. No. 17/115,764.
Claims priority of application No. 2019-221931 (JP), filed on Dec. 9, 2019.
Prior Publication US 2021/0170545 A1, Jun. 10, 2021
Int. Cl. B24B 55/03 (2006.01); B24B 37/015 (2012.01); B24B 37/20 (2012.01)
CPC B24B 55/03 (2013.01) [B24B 37/015 (2013.01); B24B 37/20 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A system, comprising:
a heat exchanging member that is capable of exchanging heat with a surface of a polishing pad; and
a liquid supply unit that supplies a liquid to the heat exchanging member,
wherein the liquid supply unit comprises
a pump device that adjusts a flow amount of a liquid flowing through a heating liquid supply line,
a needle valve that is attached to a cooling liquid supply line,
a pulsation attenuator attached to a cooling liquid supply line,
a cooling liquid supply valve that is attached to the cooling liquid supply line,
a pressure sensor that is attached to the cooling liquid supply line, and
a control device that controls operations of the pump device and the needle valve,
wherein the needle valve is disposed on a downstream side of the cooling liquid supply valve, the pulsation attenuator is disposed on an upstream side of the cooling liquid supply valve, the pressure sensor is disposed on a downstream side of the needle valve, and the heat exchanging member is disposed on a downstream side of the pressure sensor, wherein the downstream sides and the upstream sides are with respect to a flow direction of the liquid flow through the cooling liquid supply line.