	US 11,992,897 B2
	Apparatus and method for laser machining a workpiece
Tim Hesse, Ditzingen (DE); Daniel Flamm, Ludwigsburg (DE); and Myriam Kaiser, Heimsheim (DE)
Assigned to TRUMPF LASER-UND SYSTEMTECHNIK GMBH, Ditzingen (DE)
Filed by TRUMPF Laser-und Systemtechnik GmbH, Ditzingen (DE)
Filed on Aug. 1, 2023, as Appl. No. 18/362,995.
Application 18/362,995 is a continuation of application No. PCT/EP2022/051529, filed on Jan. 25, 2022.
Claims priority of application No. 10 2021 102 387.4 (DE), filed on Feb. 2, 2021.
Prior Publication US 2024/0017352 A1, Jan. 18, 2024
Int. Cl. B23K 26/067 (2006.01); B23K 26/04 (2014.01)

CPC B23K 26/0676 (2013.01) [B23K 26/043 (2013.01)]

15 Claims

1. An apparatus for laser machining a workpiece in a machining plane, comprising a first laser machining unit for forming a first focal zone which extends in a first main direction of extent, and at least one further laser machining unit for forming at least one further focal zone which extends in a further main direction of extent oriented transversely to the first main direction of extent, the first focal zone and the at least one further focal zone being spaced apart from one another parallel to the machining plane at a work distance, the first laser machining unit with the first focal zone and the at least one further laser machining unit with the at least one further focal zone each being movable in an advancement direction that is oriented parallel to the machining plane, and the workpiece comprising a material that is transparent to a laser beam which respectively forms the first focal zone and the at least one further focal zone.