US 11,992,690 B2
Biostimulator having flexible circuit assembly
Wade Keller, Aliso Viejo, CA (US); Thomas B. Eby, Mountain View, CA (US); Sean McKenna, Belmont, CA (US); and Brett C. Villavicencio, Valencia, CA (US)
Assigned to PACESETTER, INC., Sylmar, CA (US)
Filed by Pacesetter, Inc., Sylmar, CA (US)
Filed on Dec. 29, 2021, as Appl. No. 17/565,322.
Application 17/565,322 is a continuation of application No. 16/687,477, filed on Nov. 18, 2019, granted, now 11,247,059.
Claims priority of provisional application 62/770,088, filed on Nov. 20, 2018.
Prior Publication US 2022/0118264 A1, Apr. 21, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. A61N 1/375 (2006.01)
CPC A61N 1/37512 (2017.08) [A61N 1/3754 (2013.01); A61N 1/3756 (2013.01); A61N 1/3758 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A flexible circuit assembly for a biostimulator, comprising:
a flexible substrate including a mounting surface having a fold region between a first mounting region and a second mounting region, wherein the flexible substrate is configured to fold along the fold region into a stacked configuration so that the first mounting region faces the second mounting region, and wherein the flexible substrate includes an aperture centered on the fold region; and
a processor on the mounting surface, wherein the processor is configured to control delivery of a pacing impulse to a feedthrough pin extending through the aperture to a target tissue.