US 11,992,259 B2
Flexible multi-arm catheter with diametrically opposed sensing electrodes
Kevin Justin Herrera, West Covina, CA (US); Christopher Thomas Beeckler, Brea, CA (US); Joseph Thomas Keyes, Sierra Madre, CA (US); and Assaf Govari, Haifa (IL)
Assigned to Biosense Webster (Israel) Ltd., Yokneam (IL)
Filed by Biosense Webster (Israel) Ltd., Yokneam (IL)
Filed on Dec. 11, 2020, as Appl. No. 17/119,949.
Application 17/119,949 is a division of application No. 15/950,994, filed on Apr. 11, 2018, abandoned.
Prior Publication US 2021/0093377 A1, Apr. 1, 2021
Int. Cl. A61B 5/00 (2006.01); A61B 5/287 (2021.01); A61B 18/14 (2006.01); A61B 18/00 (2006.01)
CPC A61B 18/1492 (2013.01) [A61B 5/6858 (2013.01); A61B 2018/00375 (2013.01); A61B 2018/00577 (2013.01); A61B 2018/1467 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A medical instrument, comprising:
a shaft for insertion into a body of a patient;
multiple flexible spines, each multiple flexible spine comprising a respective circuit board substrate, the multiple flexible spines having respective first ends that are connected to a distal end of the shaft and respective second ends that are free-standing and unanchored, the circuit board substrates each comprising a folding line,
wherein the multiple flexible spines are bent proximally such that the second ends are more proximal than the first ends, and wherein each of the multiple flexible spines comprises a tensile layer configured to cause the multiple flexible spines to bend proximally; and
multiple electrodes disposed over the multiple flexible spines, the multiple electrodes comprising multiple pairs of first and second electrodes; and
wherein the circuit board substrates are folded along the folding line so that, for each respective pair of first and second electrodes, the first electrode and the second electrode are (i) disposed over diametrically opposing facets of the respective circuit board substrate, (ii) separated electrically along the folding line, and (iii) electrically connected to one another by a via extending through the respective circuit board substrate.