US 12,317,664 B2
Light-emitting device and manufacturing method thereof
Min-Hsun Hsieh, Hsinchu (TW)
Assigned to EPISTAR CORPORATION, Hsinchu (TW)
Filed by EPISTAR CORPORATION, Hsinchu (TW)
Filed on Feb. 5, 2024, as Appl. No. 18/433,367.
Application 18/433,367 is a continuation of application No. 18/164,629, filed on Feb. 6, 2023, granted, now 11,894,507.
Application 18/433,367 is a continuation of application No. 17/165,886, filed on Feb. 2, 2021, granted, now 11,621,384, issued on Apr. 4, 2023.
Application 18/164,629 is a continuation of application No. 17/165,886, filed on Feb. 2, 2021, granted, now 11,621,384, issued on Apr. 4, 2023.
Application 17/165,886 is a continuation of application No. 16/411,145, filed on May 14, 2019, granted, now 10,923,641, issued on Feb. 16, 2021.
Claims priority of provisional application 62/697,387, filed on Jul. 12, 2018.
Claims priority of provisional application 62/670,900, filed on May 14, 2018.
Prior Publication US 2024/0234660 A1, Jul. 11, 2024
Int. Cl. H10H 20/857 (2025.01); H10H 20/01 (2025.01)
CPC H10H 20/857 (2025.01) [H10H 20/036 (2025.01); H10H 20/0364 (2025.01)] 16 Claims
OG exemplary drawing
 
1. A method of manufacturing a light-emitting device, comprising:
providing a first substrate comprising a first connecting pad, a second connecting pad, and a third connecting pad arranged between the first connecting pad and the second connecting pad without being interposed by any other connecting pad thereamong;
providing a second substrate, a first light-emitting element, a second light-emitting element, and a third light-emitting element arranged on the second substrate, and the third light-emitting element arranged between the first light-emitting element and the second light-emitting element; and
connecting the third light-emitting element to the third connecting pad;
wherein, the third connecting pad is separated from the first connecting pad by a first distance, the third connecting pad is separated from the second connecting pad by a second distance which is different from the first distance,
wherein, before the connecting step, the first substrate further comprises a fifth light-emitting element connected to the first connecting pad, and a sixth light-emitting element connected to the second connecting pad,
wherein, in the connecting step, the first light-emitting element is overlapped with the first connecting pad.