US 12,317,659 B2
Method of making a packaged device
Chen-Fu Chu, Hsinchu (TW); and Trung Tri Doan, Hsinchu County (TW)
Assigned to TSLC Corporation, Chu-Nan (TW)
Filed by TSLC Corporation, Miao-Li County (TW)
Filed on Dec. 8, 2021, as Appl. No. 17/544,954.
Prior Publication US 2023/0178697 A1, Jun. 8, 2023
Int. Cl. H10H 20/857 (2025.01); H10H 20/01 (2025.01); H10H 20/851 (2025.01); H10H 20/853 (2025.01)
CPC H10H 20/857 (2025.01) [H10H 20/851 (2025.01); H10H 20/853 (2025.01); H10H 20/0364 (2025.01)] 13 Claims
OG exemplary drawing
 
1. A pad-extended LED chip comprising:
a LED chip comprising a substrate, a first type semiconductor layer, an active layer and a second type semiconductor layer;
a first pad electrically connected to the first type semiconductor layer and a second pad electrically connected to the second type semiconductor layer;
a first pad extended metal layer making direct physical and electrical contact to the first pad and a second pad extended metal layer making direct physical and electrical contact to the second pad; and
a first package extended pad electrically connected to the first pad extended metal layer and a second package extended pad electrically connected to the second pad extended metal layer.